Semiconductor Devices, Methods of Manufacturing Thereof, and Image Sensor Devices

ABSTRACT

Semiconductor devices, methods of manufacturing thereof, and image sensor devices are disclosed. In some embodiments, a semiconductor device comprises a semiconductor chip comprising an array region, a periphery region, and a through-via disposed therein. The semiconductor device comprises a guard structure disposed in the semiconductor chip between the array region and the through-via or between the through-via and a portion of the periphery region.

This application is a continuation of U.S. patent application Ser. No.15/608,722, entitled “Semiconductor Devices, Methods of ManufacturingThereof, and Image Sensor Devices,” filed May 30, 2017, which is acontinuation of U.S. patent application Ser. No. 15/066,658, entitled“Semiconductor Devices, Methods of Manufacturing Thereof, and ImageSensor Devices,” filed on Mar. 10, 2016, now U.S. Pat. No. 9,666,630,which is a continuation of U.S. patent application Ser. No. 14/063,953,entitled “Semiconductor Devices, Methods of Manufacturing Thereof, andImage Sensor Devices,” filed on Oct. 25, 2013, now U.S. Pat. No.9,312,294, which application is hereby incorporated herein by reference.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as personal computers, cell phones, digital cameras, and otherelectronic equipment, as examples. Semiconductor devices are typicallyfabricated by sequentially depositing insulating or dielectric layers,conductive layers, and semiconductive layers of material over asemiconductor substrate, and patterning or processing the substrateand/or the various material layers using lithography to form circuitcomponents and elements thereon. Dozens or hundreds of integratedcircuits are typically manufactured on a single semiconductor wafer. Theindividual dies are singulated by sawing the integrated circuits along ascribe line. The individual dies are then packaged separately, inmulti-chip modules, in other types of packaging, or used directly in anend application, for example.

Integrated circuit dies are typically formed on a front side ofsemiconductor wafers. The integrated circuit dies may comprise variouselectronic components, such as transistors, diodes, resistors,capacitors, and other devices. The integrated circuit dies may comprisevarious functions, such as logic memory, processors, and/or otherfunctions.

Complementary metal oxide semiconductor (CMOS) image sensor (CIS)devices are semiconductor devices that are used in some cameras, cellphones, and other devices for capturing images. Back side illumination(BSI) image sensors are CIS devices in which light enters from a backside of a substrate, rather than the front side. BSI sensors are capableof capturing more of an image signal than front side illumination imagesensors due to reduced reflection of light, in some applications.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIG. 1 is a perspective view illustrating a semiconductor device inaccordance with some embodiments of the present disclosure;

FIG. 2 is a cross-sectional view of a portion of the semiconductordevice shown in FIG. 1 in accordance with some embodiments;

FIG. 3 is a top view that illustrates a guard structure disposed withina semiconductor device in accordance with some embodiments;

FIG. 4 is a cross-sectional view of a portion of the semiconductordevice shown in FIG. 3 in accordance with some embodiments;

FIGS. 5 through 7 are top views of semiconductor devices that illustratevarious shapes and configurations of guard structures for semiconductordevices in accordance with some embodiments; and

FIG. 8 is a flow chart showing a method of manufacturing a semiconductordevice in accordance with some embodiments.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the embodiments andare not necessarily drawn to scale.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The making and using of some of the embodiments of the presentdisclosure are discussed in detail below. It should be appreciated,however, that the present disclosure provides many applicable inventiveconcepts that can be embodied in a wide variety of specific contexts.The specific embodiments discussed are merely illustrative of specificways to make and use the disclosure, and do not limit the scope of thedisclosure.

Some embodiments of the present disclosure are related to semiconductordevices, manufacturing processes thereof, and image sensor devices.Novel guard structures and methods of formation thereof forsemiconductor devices and image sensor devices will be described herein.

FIG. 1 is a perspective view illustrating a semiconductor device 100 inaccordance with some embodiments of the present disclosure. FIG. 2 is across-sectional view of a portion of the semiconductor device 100 shownin FIG. 1 in accordance with some embodiments. The semiconductor device100 includes three semiconductor chips W1, W2 and Wn bonded together.Semiconductor chip W1 comprises a first semiconductor chip that isbonded to a second semiconductor chip W2. A third semiconductor chip Wnis bonded to the second semiconductor chip W2. Only three semiconductorchips W1, W2 and Wn are shown in the drawings of the present disclosure;alternatively, the semiconductor device 100 may comprise a singlesemiconductor chip W1, two semiconductor chips W1, W2, or Wn, or four ormore semiconductor chips, not shown.

The semiconductor chips W1, W2 and Wn may be bonded together using asuitable wafer bonding technique. Some examples of commonly used bondingtechniques for wafer bonding include direct bonding, chemicallyactivated bonding, plasma activated bonding, anodic bonding, eutecticbonding, glass frit bonding, adhesive bonding, thermo-compressivebonding, reactive bonding and/or the like. After the semiconductor chipsor wafers W1, W2, and Wn are bonded together, the interface between eachpair of adjacent semiconductor wafers W1, W2 and Wn may provide anelectrically conductive path between the stacked semiconductor wafersW1, W2, and Wn. In accordance with some embodiments, in a direct bondingprocess, the connection between the adjacent semiconductor wafers W1,W2, and Wn can be implemented using metal-to-metal bonding (e.g.,copper-to-copper bonding), dielectric-to-dielectric bonding (e.g.,oxide-to-oxide bonding), metal-to-dielectric bonding (e.g.,oxide-to-copper bonding), any combinations thereof, and/or the like. Insome embodiments, at least two of the adjacent semiconductor wafers W1,W2, and Wn are bonded together using a suitable metal-dielectric bondingtechnique such as a copper-silicon oxide nitride (Cu-SiON) bondingprocess, as another example.

One or more through-vias 110, 110 a, 110 b, and 110 c may be formedwithin the semiconductor device 100 that provide vertical electricalconnections for the semiconductor device 100. The semiconductor device100 includes a plurality of through-vias 110, 110 a, 110 b, and 110 c inaccordance with some embodiments. Reference number 110 labels thethrough-vias generally, and reference numbers 110 a, 110 b, and 110 clabel the through-vias according to the depths that they extend withinthe semiconductor device 100. Through-vias 110 a extend at leastpartially through the first semiconductor chip W1 and provide verticalelectrical connections for the first semiconductor chip W1, e.g., froman upper layer to an underlying lower layer, or between the variousmaterial layers of the first semiconductor chip W1. Through-vias 110 bextend through the first semiconductor chip W1 and at least partiallythrough the second semiconductor chip W2, providing vertical electricalconnections between the first semiconductor chip W1 and the secondsemiconductor chip W2. Through-vias 110 c extend through the firstsemiconductor chip W1 and the second semiconductor chip Wn, and at leastpartially through the third semiconductor chip Wn, providing verticalelectrical connections between the first semiconductor chip W1 and thethird semiconductor chip Wn. Only three through-vias 110 a, 110 b, and110 c are shown extending through the first, second, and/or thirdsemiconductor chips W1, W2 and Wn; however, alternatively, a pluralityof the through-vias 110 a, 110 b, and 110 c may extend through thefirst, second, and/or third semiconductor chips W1, W2 and Wn, as shownat 110 in FIG. 1, for example.

The first semiconductor chip W1 includes an array region 112, aperiphery region 116, and at least one through-via 110, 110 a, 110 b,and 110 c disposed therein. The first semiconductor chip W1 includes anintermediate region 114 disposed between the through-vias 110, 110 a,110 b, and 110 c and the array region 112, in accordance with someembodiments of the present disclosure.

The array region 112 includes a plurality of devices formed therein. Insome embodiments, the plurality of devices in the array region 112comprises a plurality of pixels, shown in FIG. 2, e.g., wherein thesemiconductor device 100 comprises an image sensor device. The firstsemiconductor chip W1 comprises a pixel array wafer in some embodiments,for example. The array region 112 of the first semiconductor chip W1comprises an array of pixels 122 in accordance with some embodiments,for example. In some embodiments, the first semiconductor chip W1comprises a complementary metal oxide semiconductor (CMOS) image sensor(CIS) wafer or device, for example. The semiconductor device 100comprises a stacked CMOS image sensor device in some embodiments, asanother example.

FIG. 2 illustrates portions of the various regions of the firstsemiconductor chip W1 and the second semiconductor chip W2 in moredetail. The first semiconductor chip W1 includes a substrate 102 a andan inter-metal dielectric (IMD) 104 a disposed over the substrate 102 a.The substrate 102 a may include a semiconductor substrate comprisingsilicon or other semiconductor materials and may be covered by aninsulating layer, for example. The substrate 102 a may also includeother active components or circuits, not shown. The substrate 102 a maycomprise silicon oxide over single-crystal silicon, for example.Compound semiconductors, GaAs, InP, Si/Ge, or SiC, as examples, may beused in place of silicon. The substrate 102 a may comprise asilicon-on-insulator (SOI) or a germanium-on-insulator (GOI) substrate,as examples. In embodiments wherein the first semiconductor chip W1comprises a CIS wafer, the substrate 102 a may include a variety ofelectrical circuits and/or devices. The electrical circuits formed onthe substrate 102 a may be any type of circuitry suitable for aparticular application. In accordance with some embodiments, theelectrical circuits may include various n-type metal-oxide semiconductor(NMOS) and/or p-type metal-oxide semiconductor (PMOS) devices such astransistors, capacitors, resistors, diodes, photo-diodes, fuses and/orthe like. For example, in accordance with some embodiments, the firstsemiconductor chip W1 includes at least one periphery device 126 (seeFIG. 2) in the periphery region 116. Only one periphery device 126 isshown in FIG. 2; alternatively, a plurality of periphery devices 126 maybe formed in the periphery region 116 (see FIG. 7). The periphery device126 comprises a transistor in the embodiment shown; alternatively, theperiphery devices 126 may comprise other types of circuit elements.

The IMD 104 a comprises a plurality of insulating material layers thatinclude a plurality of conductive lines 106 a and conductive vias 108 aformed therein. The IMD 104 a, conductive lines 106 a, and conductivevias 108 a provide electrical connections for the first semiconductorchip W1 in a horizontal and vertical direction. The insulating materiallayers of the IMD 104 a may comprise silicon dioxide, silicon nitride,low dielectric constant (k) insulating materials having a dielectricconstant or k value less than silicon dioxide (e.g., a k value of about3.9 or less), extra-low k (ELK) dielectric materials having a k value ofabout 3.0 or less, or other types of materials, as examples. Theconductive lines 106 a and vias 108 b may comprise materials such as Cu,Al, alloys thereof, seed layers, and/or barrier layers formed usingdamascene and/or subtractive etch processes, as examples. Alternatively,the IMD 104 a, conductive lines 106 a, and conductive vias 108 b maycomprise other materials and may be formed using other methods.

In some embodiments, the periphery region 116 is disposed around thearray region 112, as shown in FIG. 1. For example, the array region 112of the first semiconductor chip W1 may be located in a substantiallycentral region of the first semiconductor chip W1, and the peripheryregion 116 may be disposed around a perimeter of the first semiconductorchip W1, around the array region 112. The through-vias 110, 110 a, 110b, and 110 c are disposed between the array region 112 and the peripheryregion 116. Alternatively, the arrangement of the array region 112,periphery region 116, and through vias 110, 110 a, 110 b, and 110 c maycomprise other shapes and configurations. As another example, the arrayregion 112 may be located in one corner of the first semiconductor chipW1, and the periphery region 116 may be located in an L-shaped regionproximate the array region 112.

In embodiments wherein the array region 112 includes an array of pixels,the pixel array 122 is formed within the substrate 102 a, as shown inFIG. 2. In some embodiments, a color filter material 124 is formed overthe array of pixels 122, and a lens material 125 is formed over thecolor filter material 124. The pixels in the pixel array 122 are adaptedto sense images received by the pixel array 122. The color filtermaterial 124 is adapted to separate light to a red-green-blue (R, G, orB) original element when the semiconductor device 100 is utilized as aback side illumination image sensor, for example. The color filtermaterial 124 comprises a photosensitive material in some embodiments, asanother example. The lens material 125 may comprise a micro-lensmaterial in some embodiments, as an example. Alternatively, the colorfilter material 124 and the lens material 125 may comprise othermaterials. In some embodiments, the color filter material 124 and/or thelens material 125 are not included, and the array region 112 may includeother types of devices than pixels.

The second semiconductor chip W2 includes a substrate 102 b thatincludes a plurality of devices 128 formed therein. The substrate 102 bmay include similar materials and devices as described for the substrate102 a of the first semiconductor chip W1, for example. The secondsemiconductor chip W2 includes an IMD 104 b, a plurality of conductivelines 106 b, and a plurality of conductive vias 108 b disposed over thesubstrate 102 b, that comprise similar materials as described for thefirst semiconductor chip W1. The first semiconductor chip W1 is invertedbefore bonding the first semiconductor chip W1 to the secondsemiconductor chip W2, as illustrated in FIG. 2, in some embodiments.

The third semiconductor chip Wn comprises similar materials as describedfor the first and second semiconductor chips W1 and W2, such as asubstrate, various circuits and/or devices formed thereon, and an IMD,conductive lines, and vias, not shown, in some embodiments.

In accordance with some embodiments of the present disclosure, a guardstructure (not shown in FIGS. 1 and 2; see guard structures 130 shown inFIGS. 3 and 4) is disposed in the first semiconductor chip W1 betweenthe array region 112 and one of the through-vias 110, 110 a, 110 b,and/or 110 c (e.g., in the intermediate region 114), or between one ofthe through-vias 110, 110 a, 110 b, and/or 110 c and a portion of theperiphery region 116. In some embodiments, a guard structure 130 isincluded in the first semiconductor chip W1 between both the arrayregion 112 and one of the through-vias 110, 110 a, 110 b, and/or 110 cand also between one of the through-vias 110, 110 a, 110 b, and/or 110 cand a portion of the periphery region 116. In some embodiments, a guardstructure 130 is disposed in the first semiconductor chip W1 between thearray region 112 and one of the through-vias 110, 110 a, 110 b, and/or110 c (e.g., in the intermediate region 114), and/or between one of thethrough-vias 110, 110 a, 110 b, and/or 110 c and a periphery device 126in the periphery region 116.

For example, in FIGS. 1 and 2, regions A illustrate regions where aguard structure 130 is formed in the first semiconductor chip W1 betweenthe array region 112 and one of the through-vias 110 a, 110 b, and/or110 c in the intermediate region 114. Region B illustrates a regionwhere a guard structure 130 is formed in the first semiconductor chip W1between one of the through-vias 110 a, 110 b, and/or 110 c and a portionof the periphery region 116 or a periphery device 126 in the peripheryregion 116.

FIG. 3 is a top view of a semiconductor device 100 which illustrates aguard structure 130 disposed within the semiconductor device 100 inaccordance with some embodiments. In some embodiments, the guardstructure 130 comprises two or more portions (e.g., two portions areshown in FIG. 3), which portions are also referred to herein as guardstructures 130. The guard structures 130 substantially comprise a shapein the top view of the first semiconductor chip W1 of the semiconductordevice 100 of a rectangle in the embodiments shown. The guard structures130 may also substantially comprise a shape in the top view of a square,e.g., in embodiments wherein the semiconductor device 100 issubstantially square or other shapes. The guard structures 130 compriserings of continuous material (or non-continuous in other embodiments, tobe described further herein with reference to FIG. 5) aroundpredetermined regions of the semiconductor device 100, in someembodiments. The two portions of the guard structure 130 shown in FIG. 3include a first guard structure 130 disposed around the array region 112including the pixel array 122 between the array region 112 and thethrough-vias 110; and a second guard structure 130 disposed around thethrough-vias 110 and the array region 112 between the through vias 110and the periphery device 126 in the periphery region 116. Alternatively,the guard structure 130 may comprise one portion, or three or moreportions.

FIG. 4 is a cross-sectional view of a portion of the semiconductordevice 100 shown in FIG. 3, at view 4-4′ of FIG. 3 in accordance withsome embodiments. More detailed views of the guard structure 130 inregion A and the guard structure 130 in region B in accordance with someembodiments are illustrated in FIG. 4. The guard structures 130 may eachcomprise a metal feature 130 a, a P-type region 130 b, an N-type region130 c, or a combination thereof, in some embodiments. In someembodiments, the guard structures 130 may comprise only a metal feature130 a, only an N-type region 130 c, only a P-type region 130 b, or acombination of two or more thereof, for example. The guard structures130 may comprise a plurality of the metal features 130 a, a plurality ofthe P-type regions 130 b, a plurality of the N-type regions 130 c, or acombination thereof, in other embodiments.

In embodiments wherein the guard structure or structures 130 include ametal feature 130 a, the guard structure 130 may comprise a trenchformed within the substrate 102 a of the first semiconductor chip W1.The metal feature 130 a comprises a conductive material disposed withinthe trench. The conductive material of the metal feature 130 a maycomprise W, Cu, AlCu, other conductive materials, and/or combinationsthereof, as examples.

The trench of the guard structure 130 comprising the metal feature 130 amay be formed in some embodiments using a lithography process, byforming a layer of photoresist (not shown) over the substrate 102 a,patterning the layer of photoresist by exposing the layer of photoresistto energy reflected from or transmitted through a lithography mask (alsonot shown) having a desired pattern thereon, developing the layer ofphotoresist, and removing exposed or unexposed portions of the layer ofphotoresist (depending on whether the photoresist comprises a positiveor negative photoresist) using an ashing and/or etch process. The layerof photoresist is then used as an etch mask while portions of thesubstrate 102 a are etched away using an etch process. The patterningprocess for the substrate 102 a of the first semiconductor chip W1 maybe performed before or after the first semiconductor chip W1 is bondedto another semiconductor chip, for example. Alternatively, the trenchesfor the metal features 110 a may be formed using a direct patterning,laser drilling, or other type of process.

After the trenches are formed in the substrate 102 a, the trenches arefilled with a material. Filling the trenches with the material comprisesfilling the trenches with an insulating material, a conductive material,or a combination thereof in some embodiments. For example, in FIG. 4,the trenches are first lined with an insulating material 132 a beforeforming the conductive material of the conductive features 110 a. Theinsulating material 132 a comprises about 1 nm to about 20 μm of silicondioxide, silicon nitride (SiN), silicon oxynitride (SiON), acarbon-containing layer such as SiC, tantalum pentoxide (Ta₂O₅),aluminum oxide (Al₂O₃), hafnium oxide (HfO₂), other insulatingmaterials, or combinations or multiple layers thereof in someembodiments. In other embodiments, an insulating material 132 a is notformed in the trenches. The conductive material of the metal feature 130a is then formed within the trenches over the insulating material 132 a,or directly into the trenches if the insulating material 132 a is notincluded. The conductive material may be formed using a sputteringprocess, electro-chemical plating (ECP), physical vapor deposition(PVD), or other methods, for example. Excess conductive material may beremoved from over a top surface of the substrate 102 a using achemical-mechanical polishing (CMP) process, an etch process, or acombination thereof, for example. A barrier 136 may be disposed over atop surface of the metal features 130 a, also shown in FIG. 4. Thebarrier 136 comprises a material such as an insulator that is adapted toprevent out-diffusion of a conductive material of the metal feature 130a, preventing contamination in some embodiments, for example. In otherembodiments, the barrier 136 is not included.

In FIG. 4, a through-via 110 a formed within the first semiconductorchip W1 is shown. A through-via 110 b formed within the firstsemiconductor chip W1 and that also extends into the secondsemiconductor chip W2 is shown in phantom (e.g., in dashed lines). Athrough-via 110 b formed within the first semiconductor chip W1 and thatextends through the second semiconductor chip W2 and into the thirdsemiconductor chip Wn is also shown in phantom.

The through-vias 110 a, 110 b, and 110 c may be formed in thesemiconductor device 100 after the bonding process for the semiconductorchips W1, W2, and Wn, in some embodiments. Trenches for the through-vias110 a, 110 b, and 110 c can be formed after the bonding process and thenfilled with a conductive material, such as W, Cu, AlCu, other conductivematerials, and/or combinations or multiple layers thereof, as examples.The trenches are lined with about 0.5 μm to about 20 μm of an insulatingmaterial 138 such as silicon dioxide, SiN, SiON, a carbon-containinglayer such as SiC, Ta₂O₅, Al₂O₃, HfO₂, other insulators, or combinationsor multiple layers thereof in some embodiments, before forming theconductive material of the through-vias 110 a, 110 b, and 110 c.

In other embodiments, portions of the through-vias 110 a, 110 b, and 110c may be formed before the bonding process during the manufacturingprocess of each of the semiconductor chips W1, W2, and Wn. The portionsof the through-vias 110 a, 110 b, and 110 c are positioned so that theyalign after the bonding process for the semiconductor chips W1, W2, andWn in these embodiments, for example.

In embodiments wherein the guard structure or structures 130 include anN-type region 130 c or a P-type region 130 b, the guard structure orstructures 130 may be formed by implanting the substrate 102 a of thefirst semiconductor chip W1 and/or epitaxially growing a material with atrench formed in the substrate 102 a to form a P-type material, anN-type material, or a combination thereof, for example, in accordancewith some embodiments. The substrate 102 a of the first semiconductorchip W1 may be implanted with a dopant such as B, As, or P; or SiGe orSiC implanted with B, As, or P, may be epitaxially grown in the trenchesformed in the substrate 102 a to form the guard structures 130comprising the N-type regions 130 c or the P-type regions 130 b, asexamples. Alternatively, the N-type regions 130 c and the P-type regions130 b may be formed using other methods.

An insulating material 132 b may be included in the first semiconductorchip W1 proximate the N-type regions 130 c or the P-type regions 130 b,also shown in FIG. 4. The insulating material 132 b may comprise shallowtrench isolation (STI) regions, in some embodiments. A contact (notshown) may also be disposed over a top surface of the N-type regions 130c or the P-type regions 130 b, as illustrated for the guard structures130 comprising the metal features 130 a. In some embodiments, at leastportions of the N-type regions 130 c or the P-type regions 130 b may beformed during the manufacturing process of other devices of the firstsemiconductor chip W1, such as the periphery devices 126, for example.Alternatively, additional processing steps can be included to form theN-type regions 130 c or the P-type regions 130 b.

In some embodiments, the guard structure or structures 130 comprise awidth comprising dimension d1 in the cross-sectional view shown in FIG.4, wherein dimension d1 comprises about 0.01 μm or greater, in someembodiments. The guard structure or structures 130 are spaced apart fromthe through-via 110 a, 110 b, or 110 c by a dimension d2 that comprisesabout 0.1 μm or greater, in some embodiments. The guard structure orstructures 130 are formed at a depth of dimension d3 or d4 thatcomprises about 0.01 μm to about 100 μm below a surface of the firstsemiconductor chip W1, in some embodiments. In embodiments wherein theguard structures 130 comprise an N-type region 130 c or a P-type region130 b, dimension d3 comprises about 0.01 μm to about 20 μm below asurface of the first semiconductor chip W1, as another example.

In some embodiments, a voltage may be applied during the operation ofthe semiconductor device 100 to the guard structure or structures 130.For example, in embodiments wherein the guard structure 130 comprises ametal feature 130 a, a voltage of about −10 Volts (V) to about 10 V maybe applied to the metal feature 130 a during the operation of thesemiconductor device 100. In embodiments wherein the guard structure 130comprises a P-type region 130 b, a voltage of about 0 V to about −10 Vmay be applied to the P-type region 130 b during the operation of thesemiconductor device 100. In embodiments wherein the guard structure 130comprises an N-type region 130 c, a voltage of about 0.1 V to about 10 Vmay be applied to the N-type region 130 c during the operation of thesemiconductor device 100. Alternatively, other voltage levels may beapplied to the ground structures 130 during the operation of thesemiconductor devices 100 described herein. Applying the voltage to theguard structure 130 improves noise reduction of the guard structures 130in some embodiments, for example. In other embodiments, a voltage maynot be applied.

Two guard structures 130 are shown in FIGS. 3 and 4; alternatively, one,two, or three or more guard structures 130 may be included in asemiconductor device 100 in accordance with some embodiments.

FIGS. 5 through 7 are top views of semiconductor devices 100 thatillustrate various shapes and configurations of guard structures 130,130′ and 130″ for semiconductor devices 100 in accordance with someembodiments. In accordance with some embodiments, the guard structures130 may substantially comprise a shape in a top view of the firstsemiconductor chip W1 of a square or a rectangle (i.e., the embodimentsshown in FIG. 3 and previously described herein, and in the embodimentsshown in FIGS. 6 and 7). In other embodiments, the guard structures 130′and 130″ may substantially comprise a shape in a top view of the firstsemiconductor chip W1 of a continuous bar, a plurality of continuousbars, a non-continuous bar, or a plurality of non-continuous bars (i.e.,the embodiments shown in FIG. 5). In yet other embodiments, the guardstructures 130, 130′, and 130″ may comprise combinations of the variousshapes described herein.

In some embodiments, the guard structures 130 may be disposed proximateor around the array region 112 (i.e., the embodiments shown in FIGS. 3and 5), disposed proximate or around the plurality of through-vias 110(i.e., the embodiments shown in FIGS. 3, 5, 6, and 7), disposedproximate or around the plurality of through-vias 110 and the arrayregion (i.e., the embodiments shown in FIGS. 3 and 5), disposedproximate or around one of the plurality of through-vias 110 (i.e., theembodiments shown in FIG. 6), disposed proximate or around a group ofthe plurality of through-vias 110 (i.e., the embodiments shown in FIG.6), disposed proximate or around one of the plurality of peripherydevices 126 (i.e., the embodiments shown in FIG. 7), disposed proximateor around a group of the plurality of periphery devices 126 (i.e., theembodiments shown in FIG. 7), or a combination thereof.

In FIG. 5, guard structures 130′ substantially comprising a shape of acontinuous bar are disposed proximate the through-vias 110. For example,the guard structures 130′ extend along a row of the through-vias 110along each side of the semiconductor device 100. The semiconductordevice 100 includes guard structures 130′ comprising a plurality ofcontinuous bars, for example. The guard structures 130′ are disposedeither between the through-vias 110 and the array region 112, or betweenthe through-vias 110 and the periphery region 116, or both. All or someof the guard structures of a semiconductor device 100 may comprise aguard structure 130′ substantially having a shape of a continuous bar,in accordance with some embodiments.

Guard structure 130″ substantially comprising a shape of a plurality ofnon-continuous bars are disposed proximate a group of the plurality ofthrough-vias 110. For example, the guard structures 130″ extends along arow of the through-vias 110 along each one side of the semiconductordevice 100, and the guard structures 130″ are disposed between thethrough-vias 110 and the array region 112 in the embodiment shown inFIG. 5. In other embodiments, the guard structures 130″ may be disposedeither between the through-vias 110 and the array region 112, betweenthe through-vias 110 and the periphery region 116, or both (not shown).All or some of the guard structures of a semiconductor device 100 maycomprise a guard structure 130″ substantially comprising a shape of aplurality of non-continuous bars, in accordance with some embodiments.

FIG. 6 illustrates some embodiments of the present disclosure wherein aguard structure 130 is disposed around a group of the plurality ofthrough-vias 110, as shown along the left side of the semiconductordevice 100. The guard structure 130 substantially comprises a shape of arectangle in the top view. A portion of the guard structure 130 isdisposed between the through-vias 110 and the array region 112, and apotion of the guard structure 130 is disposed between the through-vias110 and the periphery region 116. All or some of the guard structures ofa semiconductor device 100 may comprise a guard structure 130substantially comprising a rectangular shape that is disposed around agroup of the through-vias 110, in accordance with some embodiments.

FIG. 6 also illustrates some embodiments of the present disclosurewherein a guard structure 130 is disposed around one of the plurality ofthrough-vias 110′, as shown at the top side of the semiconductor device100. The guard structure 130 substantially comprises a shape of a squarein the top view. A portion of the guard structure 130 is disposedbetween the through-vias 110 and the array region 112, and a potion ofthe guard structure 130 is disposed between the through-vias 110 and theperiphery region 116. All or some of the guard structures 130 of asemiconductor device 100 may comprise a guard structure 130 having asubstantially square shape that is disposed around one or all of thethrough-vias 110, in accordance with some embodiments.

FIG. 7 illustrates some embodiments of the present disclosure wherein aguard structure 130 is disposed around a group of the plurality ofperiphery devices 126, as shown along the left side of the semiconductordevice 100. The guard structure 130 substantially comprises a shape of arectangle in the top view. A portion of the guard structure 130 isdisposed between the through-vias 110 and the array region 112, and apotion of the guard structure 130 is disposed between the through-vias110 and the periphery devices 126 in the periphery region 116. All orsome of the guard structures of a semiconductor device 100 may comprisea guard structure 130 having a substantially rectangular shape that isdisposed around a group of the periphery devices 126, in accordance withsome embodiments.

FIG. 7 also illustrates some embodiments of the present disclosurewherein a guard structure 130 is disposed around one of the peripherydevices 126′, as shown along the top side of the semiconductor device100. The guard structure 130 substantially comprises a shape of a squarein the top view. A portion of the guard structure 130 is disposedbetween the through-vias 110 and the array region 112, and a potion ofthe guard structure 130 is disposed between the through-vias 110 and theperiphery device 126 in the periphery region 116. All or some of theguard structures 130 of a semiconductor device 100 may comprise a guardstructure 130 having a substantially square shape that is disposedaround one or all of the periphery devices 126, in accordance with someembodiments.

In the embodiments shown in FIG. 6, the guard structures 130 mayalternatively comprise a continuous bar, a plurality of continuous bars,a non-continuous bar, a plurality of non-continuous bars, and/orcombinations thereof (i.e., as shown in FIG. 5), disposed proximate oraround a group of the through-vias 110 or one of the through-vias 110′.Likewise, In the embodiments shown in FIG. 7, the guard structures 130may alternatively comprise a continuous bar, a plurality of continuousbars, a non-continuous bar, a plurality of non-continuous bars, and/orcombinations thereof (i.e., as shown in FIG. 5), disposed proximate oraround a group of the periphery devices 126 or one of the peripherydevices 126′.

Furthermore, a guard structure of a semiconductor device 100 maycomprise one or more of the novel guard structures 130, 130′, and 130″positioned in the locations described on the semiconductor device 100herein in accordance with some embodiments, for example.

Referring again to FIG. 4, some examples of combinations of the metalfeatures 130 a, P-type regions 130 b, and N-type regions 130 c that maybe used to form the guard structures 130, 130′, and 130″ describedherein may comprise: a first P-type region 130 b, an N-type 130 c regionadjacent the first P-type region 130 b, and a second P-type region 130 badjacent the N-type region 130 c; a first metal feature 130 a, a firstP-type region 130 b proximate the first metal feature 130 a, an N-type130 c region adjacent the first P-type region 130 b, a second P-typeregion 130 b adjacent the N-type region 130 c, and a second metalfeature 130 a proximate the second P-type region 130 b; or an N-typeregion 130 c, P-type region 130 b adjacent the N-type region 130 c, anda metal feature 130 a proximate the P-type region 130 b, as examples.Alternatively, the metal features 130 a, P-type regions 130 b, andN-type regions 130 c may be combined in other configurations to form theguard structures 130, 130′, and 130″ described herein.

FIG. 8 is a flow chart 160 showing a method of manufacturing asemiconductor device 100 in accordance with some embodiments. In step162, a semiconductor chip W1 is provided (see also FIG. 1) that includesan array region 112, a periphery region 116, and a through-via 110 adisposed therein. In step 164, a guard structure 130 is formed in thesemiconductor chip W1 between the array region 112 and the through via110 a or between the through-via 110 a and a portion of the peripheryregion 116 (see FIG. 3).

Some embodiments of the present disclosure include manufacturing methodsfor semiconductor devices 100, and also include semiconductor devices100 manufactured using the methods and that include the novel guardstructures 130, 130′, and 130″ described herein. Some embodiments of thepresent disclosure also include image sensor devices that include theguard structures 130, 130′, and 130″ described herein.

In some embodiments, the image sensor devices comprise stackedcomplementary metal oxide semiconductor (CMOS) back side illumination(BSI) image sensor devices, for example. Referring again to FIG. 1, atop surface of the first semiconductor chip W1 comprises a back side ofthe semiconductor device 100, in some embodiments. The through-vias 110extend from the back side surface through at least a portion of thefirst semiconductor chip W1 in these embodiments, for example. The guardstructures 130 described herein extend from the back side surface fullythrough the substrate 102 a of the first semiconductor chip W1, as shownin FIG. 4, in accordance with some embodiments.

Advantages of some embodiments of the disclosure include providing novelguard structures 130, 130′ and 130″ that improve performance ofsemiconductor devices and image sensor devices. The guard structures130, 130′, and 130″ comprise continuous or non-continuous rings ofconductive or semiconductive material that reduce or improve phenomenaof dark current, white pixels, and noise that can occur in some imagesensor applications and other semiconductor device applications, in someembodiments, for example. The guard structures 130, 130′, and 130″reduce through-via 110 process charging build-up caused by groundingpaths, noise, and tensor or compressive stress. A voltage may be appliedto the guard structure 130, 130′, and 130″ to further reduce noise, insome applications. In other applications, a voltage may not be appliedto the guard structures 130, 130′, and 130″. In embodiments wherein theguard structures 130, 130′, and 130″ include metal features 130 a, RFnoise is reduced in some embodiments, due to a shielding effect providedby the novel guard structures 130, 130′, and 130″, for example.Furthermore, the novel guard structures 130, 130′, and 130″ and designsare easily implementable in manufacturing process flows.

In accordance with some embodiments of the present disclosure, asemiconductor device includes a semiconductor chip including an arrayregion, a periphery region, and a through-via disposed therein. Thesemiconductor device includes a guard structure disposed in thesemiconductor chip between the array region and the through-via orbetween the through-via and a portion of the periphery region.

In accordance with other embodiments, a method of manufacturing asemiconductor device includes providing a semiconductor chip includingan array region, a periphery region, and a through-via disposed therein,and forming a guard structure in the semiconductor chip between thearray region and the through-via or between the through-via and aportion of the periphery region.

In accordance with other embodiments, an image sensor device includes afirst semiconductor chip including an array region, a periphery regiondisposed around the array region, and a first through-via disposedbetween the array region and the periphery region. The image sensordevice includes a second semiconductor chip bonded to the firstsemiconductor chip. The second semiconductor chip includes a secondthrough-via disposed therein, the second through-via also being disposedin the first semiconductor chip. A guard structure is disposed in thefirst semiconductor chip between the array region and the firstthrough-via or the second through-via, or between a portion of theperiphery region and the first through-via or the second through-via.

Although some embodiments of the present disclosure and their advantageshave been described in detail, it should be understood that variouschanges, substitutions and alterations can be made herein withoutdeparting from the spirit and scope of the disclosure as defined by theappended claims. For example, it will be readily understood by thoseskilled in the art that many of the features, functions, processes, andmaterials described herein may be varied while remaining within thescope of the present disclosure. Moreover, the scope of the presentapplication is not intended to be limited to the particular embodimentsof the process, machine, manufacture, composition of matter, means,methods and steps described in the specification. As one of ordinaryskill in the art will readily appreciate from the disclosure of thepresent disclosure, processes, machines, manufacture, compositions ofmatter, means, methods, or steps, presently existing or later to bedeveloped, that perform substantially the same function or achievesubstantially the same result as the corresponding embodiments describedherein may be utilized according to the present disclosure. Accordingly,the appended claims are intended to include within their scope suchprocesses, machines, manufacture, compositions of matter, means,methods, or steps.

What is claimed is:
 1. A semiconductor device comprising: asemiconductor chip comprising an array region, a periphery region, and athrough-via disposed in the semiconductor chip, the semiconductor chipcomprising a substrate and dielectric layer on a first side of thesubstrate; and a guard structure disposed in the semiconductor chipbetween the array region and the through-via or between the through-viaand the periphery region, the guard structure comprising a conductivefeature extending from the first side of the substrate to a second sideof the substrate.
 2. The semiconductor device of claim 1, wherein theperiphery region comprises a transistor.
 3. The semiconductor device ofclaim 1, wherein the guard structure further comprises a first dopedregion of a first conductivity type interposed between the conductivefeature and the through-via.
 4. The semiconductor device of claim 3,wherein the guard structure further comprises a second doped region of asecond conductive type interposed between the conductive feature and thethrough-via.
 5. The semiconductor device of claim 4, wherein the firstdoped region extends completely through the substrate.
 6. Thesemiconductor device of claim 3, wherein the first doped region extendsthrough a shallow trench isolation.
 7. The semiconductor device of claim6, wherein a tapering of the first doped region is opposite of atapering of the shallow trench isolation.
 8. The semiconductor device ofclaim 3, wherein the first doped region comprises a differentsemiconductor material than a semiconductor material of the substrate.9. A semiconductor device comprising: a first semiconductor chipcomprising an array region and a periphery region; a secondsemiconductor chip bonded to a first side of the first semiconductorchip; a first through-via extending through a substrate of the firstsemiconductor chip; and a first guard structure in the substrate of thefirst semiconductor chip between the array region and the firstthrough-via, wherein the first guard structure comprises a firstconductive feature, the first conductive feature intersecting directpaths between the array region and the first through-via in a plan view.10. The semiconductor device of claim 9, wherein the first conductivefeature completely surrounds the first through-via.
 11. Thesemiconductor device of claim 9, wherein the first guard structurefurther comprises a first doped region and a second doped region, thesecond doped region being doped an opposite conductivity of the firstdoped region.
 12. The semiconductor device of claim 11, wherein thefirst doped region and the second doped region comprises epitaxialregions.
 13. The semiconductor device of claim 9, further comprising asecond through-via, wherein the first conductive feature extends betweenthe first through-via and the second through-via.
 14. The semiconductordevice of claim 9, further comprising: a second through-via, wherein thefirst through-via is along a first sidewall of the first semiconductorchip and the second through-via is along a second sidewall of the firstsemiconductor chip, wherein the first conductive feature intersectsdirect paths between the array region and the second through-via in theplan view.
 15. The semiconductor device of claim 9, further comprising:a second through-via, wherein the first through-via is along a firstsidewall of the first semiconductor chip and the second through-via isalong a second sidewall of the first semiconductor chip; and a secondguard structure in the substrate of the first semiconductor chip betweenthe array region and the second through-via, wherein the second guardstructure comprises a second conductive feature, the second conductivefeature intersecting direct paths between the array region and thesecond through-via in the plan view, wherein the first conductivefeature is discrete from the second conductive feature.
 16. Thesemiconductor device of claim 9, wherein the first conductive feature iscoupled to a voltage source.
 17. A semiconductor device comprising: asubstrate, the substrate having an active side and a backside, thesubstrate having an array region, a periphery region extending along aboundary of the array region, and an intermediate region interposedbetween the periphery region and the array region; a through-viaextending through the substrate; a first guard structure interposedbetween the through-via and array region, the first guard structurecomprising a first conductive feature in the substrate; and a secondguard structure interposed between the through-via and an active devicein the periphery region, the second guard structure comprising a secondconductive feature in the substrate.
 18. The semiconductor device ofclaim 17, wherein the first conductive feature and the second conductivefeature are portions of a single continuous conductive feature.
 19. Thesemiconductor device of claim 17, further comprising a first dopedepitaxial region and a second doped epitaxial region interposed betweenthe first conductive feature and the through-via.
 20. The semiconductordevice of claim 19, further comprising an isolation region in thesubstrate, wherein the first doped epitaxial region and the second dopedepitaxial region extend through the isolation region.